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| MOTOROLA SEMICONDUCTOR TECHNICAL DATA Order this document by MPXAZ4115A/D Media Resistant, Integrated Silicon MPXAZ4115A Pressure Sensor for Manifold SERIES Absolute Pressure, Altimeter or Barometer Applications On-Chip Signal Conditioned, INTEGRATED PRESSURE SENSOR Temperature Compensated, and 15 to 115 kPa (2.2 to 16.7 psi) 0.2 to 4.8 V Output Calibrated Motorola's MPXAZ4115A series sensor integrates on-chip, bipolar op amp circuitry and thin film resistor networks to provide a high output signal and temperature compensation. The small form factor and high reliability of on-chip integration make the Motorola pressure sensor a logical and economical choice for the system designer. The MPXAZ4115A series piezoresistive transducer is a state-of-the-art, monolithic, signal conditioned, silicon pressure sensor. This sensor combines advanced micromachining techniques, thin film metallization, and bipolar semiconductor processing to provide an accurate, high level analog output signal that is proportional to applied pressure. Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. Features * Resistant to high humidity and common automotive media * 1.5% Maximum Error over 0 to 85C * Ideally suited for Microprocessor or Microcontroller- Based Systems * Temperature Compensated from -40 to +125C * Durable Thermoplastic (PPS) Surface Mount Package Application Examples * Aviation Altimeters * Industrial Controls * Engine Control * Weather Stations and Weather Reporting Devices VS SMALL OUTLINE PACKAGE MPXAZ4115AC6U CASE 482A MPXAZ4115A6U CASE 482 PIN NUMBER 1 2 3 4 THIN FILM TEMPERATURE COMPENSATION AND GAIN STAGE #1 GAIN STAGE #2 AND GROUND REFERENCE SHIFT CIRCUITRY N/C VS Gnd Vout 5 6 7 8 N/C N/C N/C N/C SENSING ELEMENT Vout NOTE: Pins 1, 5, 6, 7, and 8 are not device connections. Do not connect to external circuitry or ground. Pin 1 is noted by the notch in the lead. GND PINS 1, 5, 6, 7 AND 8 ARE NO CONNECTS FOR SMALL OUTLINE PACKAGE DEVICE Figure 1. Fully Integrated Pressure Sensor Schematic Rev 0 Motorola Sensor Device Data (c) Motorola, Inc. 2001 1 MPXAZ4115A SERIES MAXIMUM RATINGS(NOTE) Parametrics Maximum Pressure (P1 u P2) Storage Temperature Operating Temperature Symbol Pmax Tstg TA Value 400 -40 to +125 -40 to +125 Units kPa C C NOTE: Exposure beyond the specified limits may cause permanent damage or degradation to the device. OPERATING CHARACTERISTICS (VS = 5.1 Vdc, TA = 25C unless otherwise noted, P1 u P2. Decoupling circuit shown in Figure 3 required to meet Electrical Specifications.) Characteristic Pressure Range Supply Voltage(1) Symbol POP VS Io (0 to 85C) (0 to 85C) (0 to 85C) (0 to 85C) Voff VFSO VFSS -- V/P tR Io+ -- -- Min 15 4.85 -- 0.135 4.725 4.521 -- -- -- -- -- -- Typ -- 5.1 7.0 0.204 4.794 4.590 -- 45.9 1.0 0.1 20 0.5 Max 115 5.35 10 0.273 4.863 4.659 1.5 -- -- -- -- -- Unit kPa Vdc mAdc Vdc Vdc Vdc %VFSS mV/kPa ms mAdc ms %VFSS Supply Current Minimum Pressure Offset(2) @ VS = 5.1 Volts Full Scale Output(3) @ VS = 5.1 Volts Full Scale Span(4) @ VS = 5.1 Volts Accuracy(5) Sensitivity Response Time(6) Output Source Current at Full Scale Output Warm-Up Offset Time(7) Stability(8) NOTES: 1. Device is ratiometric within this specified excitation range. 2. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 3. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure. 4. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 5. Accuracy is the deviation in actual output from nominal output over the entire pressure range and temperature range as a percent of span at 25C due to all sources of error including the following: * Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. * Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. * Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum or maximum rated pressure at 25C. * TcSpan: Output deviation over the temperature range of 0 to 85C, relative to 25C. * TcOffset: Output deviation with minimum pressure applied, over the temperature range of 0 to 85C, relative to 25C. 6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized. 8. Offset Stability is the product's output deviation when subjected to 1000 cycles of Pulsed Pressure, Temperature Cycling with Bias Test. 2 Motorola Sensor Device Data MPXAZ4115A SERIES +5 V FLUORO SILICONE GEL DIE COAT P1 WIRE BOND LEAD FRAME DIE STAINLESS STEEL CAP THERMOPLASTIC CASE 1.0 mF 0.01 mF Vs IPS GND 470 pF Vout OUTPUT ABSOLUTE ELEMENT SEALED VACUUM REFERENCE DIE BOND Figure 2. Cross Sectional Diagram SOP (not to scale) Figure 2 illustrates the absolute sensing chip in the basic chip carrier (Case 482). Figure 3. Recommended power supply decoupling and output filtering. For additional output filtering, please refer to Application Note AN1646. Figure 3 shows the recommended decoupling circuit for interfacing the output of the integrated sensor to the A/D input of a microprocessor or microcontroller. Proper decoupling of the power supply is recommended. 5.0 4.5 4.0 OUTPUT (Volts) 3.5 3.0 2.5 2.0 1.5 1.0 0.5 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85 90 95 100 105 110 115 120 Pressure (ref: to sealed vacuum) in kPa 0 MIN TRANSFER FUNCTION: Vout = Vs* (.009*P-.095) Error VS = 5.1 Vdc TEMP = 0 to 85C MAX TYP Figure 4. Output versus Absolute Pressure Figure 4 shows the sensor output signal relative to pressure input. Typical minimum and maximum output curves are shown for operation over a temperature range of 0 to 85C using the decoupling circuit shown in Figure 3. The output will saturate outside of the specified pressure range. A gel die coat isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the sensor diaphragm. The gel die coat and durable polymer package provide a media resistant barrier that allows the sensor to operate reliably in high humidity conditions as well as environments containing common automotive media. Contact the factory for more information regarding media compatibility in your specific application. Motorola Sensor Device Data 3 MPXAZ4115A SERIES Transfer Function (MPXAZ4115A) Nominal Transfer Value: Vout = VS x (0.009 x P - 0.095) (Pressure Error x Temp. Factor x 0.009 x VS) VS = 5.1 0.25 Vdc Temperature Error Band 4.0 3.0 Temperature Error Factor 2.0 1.0 0.0 MPXAZ4115A Series Break Points Temp - 40 0 to 85 125 Multiplier 3 1 3 -40 -20 0 20 40 60 80 100 120 140 Temperature in C NOTE: The Temperature Multiplier is a linear response from 0C to -40C and from 85C to 125C Pressure Error Band 3.0 Pressure Error (kPa) 2.0 1.0 0.0 -1.0 - 2.0 - 3.0 Pressure 15 to 115 (kPa) Error (Max) 1.5 (kPa) 20 40 60 80 100 120 Pressure (in kPa) Error Limits for Pressure ORDERING INFORMATION -- SMALL OUTLINE PACKAGE Device Type Basic Element Options Absolute, Element Only Absolute, Element Only Ported Element Absolute, Axial Port Absolute, Axial Port Case No. 482 482 482A 482A MPX Series Order No. MPXAZ4115A6U MPXAZ4115A6T1 MPXAZ4115AC6U MPXAZ4115AC6T1 Packing Options Rails Tape and Reel Rails Tape and Reel Marking MPXAZ4115A MPXAZ4115A MPXAZ4115A MPXAZ4115A 4 Motorola Sensor Device Data MPXAZ4115A SERIES INFORMATION FOR USING THE SMALL OUTLINE PACKAGE (CASE 482) MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the correct size to ensure proper solder connection interface between the board and the package. With the correct fottprint, the packages will self-align when subjected to a solder reflow process. It is always recommended to design boards with a solder mask layer to avoid bridging and shorting between solder pads. 0.660 16.76 0.100 TYP 8X 2.54 0.060 TYP 8X 1.52 0.300 7.62 0.100 TYP 8X 2.54 inch mm SCALE 2:1 Figure 5. SOP Footprint (Case 482) Motorola Sensor Device Data 5 MPXAZ4115A SERIES SMALL OUTLINE PACKAGE DIMENSIONS -A- 5 4 D 8 PL 0.25 (0.010) M TB S A S -B- 8 G 1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5_ TYPICAL DRAFT. DIM A B C D G H J K M N S INCHES MIN MAX 0.415 0.425 0.415 0.425 0.212 0.230 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0_ 7_ 0.405 0.415 0.709 0.725 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 5.38 5.84 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0_ 7_ 10.29 10.54 18.01 18.41 S N C H -T- K M PIN 1 IDENTIFIER SEATING PLANE J CASE 482-01 ISSUE O -A- 5 4 D 8 PL 0.25 (0.010) M TB S A S N -B- 8 G 1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5_ TYPICAL DRAFT. DIM A B C D G H J K M N S V W INCHES MIN MAX 0.415 0.425 0.415 0.425 0.500 0.520 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0_ 7_ 0.444 0.448 0.709 0.725 0.245 0.255 0.115 0.125 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 12.70 13.21 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0_ 7_ 11.28 11.38 18.01 18.41 6.22 6.48 2.92 3.17 S W V C H J K M PIN 1 IDENTIFIER -T- SEATING PLANE CASE 482A-01 ISSUE A 6 Motorola Sensor Device Data MPXAZ4115A SERIES Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. "Typical" parameters which may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer. How to reach us: USA/EUROPE/Locations Not Listed: Motorola Literature Distribution; P.O. Box 5405, Denver, Colorado 80217. 1-303-675-2140 or 1-800-441-2447 Technical Information Center: 1-800-521-6274 JAPAN: Motorola Japan Ltd.; SPS, Technical Information Center, 3-20-1, Minami-Azabu. Minato-ku, Tokyo 106-8573 Japan. 81-3-3440-3569 ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; Silicon Harbour Centre, 2, Dai King Street, Tai Po Industrial Estate, Tai Po, N.T., Hong Kong. 852-26668334 HOME PAGE: http://www.motorola.com/semiconductors/ Motorola Sensor Device Data 7 MPXAZ4115A/D |
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